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The semiconductor industry is being reshaped by a perfect storm of consolidation and innovation. To remain competitive while navigating market and technology uncertainties, every chip company-whether innovating around GHz, acceleration, power, functionality, even experience-is stretching R&D dollars further than ever.

System Design & Validation

SoCtronics System Engineering (SE) team has expertise in Pre-Silicon Emulation/Validation and complete Post Silicon activities for both SoC and IP designs. Before IP team acquisition, SE team handled most of the IP Post-Silicon activities, i.e, from Substrate/Platform design to Validation/Characterization/Certification. SE Team services include but are not limited to Substrate/Platform design, SI/PI, Emulation, IP/SoC Validation/Characterization activities. With a well-equipped lab, extensive design debug knowledge, automated infrastructure & elaborate test plans, the SE team will be an ideal partner to provide the best platform/test solutions in a competitive timeline.

Since the inception of SoCtronics SE team, the following are a few of the accomplishments

  • 100+ IP’s characterized (Includes re-spins)
  • 20+ Characterization boards designed . 10+ Validation boards designed
  • 10+ Package Substrates designed . 3 Xilinx FPGA based platforms designed
  • Worked on getting USB, PCIe, MIPI, DDR, HDMI IP’s certified
  • In-house developed infra tools to enable quick test development and execution cycle
  • Experience in performing SI/PI for complex designs upto 25Gbps
  • Design Debug capability of both electrical/protocol issues
  • Have expertise in correlating Silicon results with design specifications
  • Executed Pre & Post Silicon Validation for 2 automotive SoC’s and 1Consumer SoC

Platform Engineering

Our Platform design team interacts with customers from the concept phase and provides various options to architect the solution. Upon finalizing the solution, the team will meticulously execute the design, layout, signal/power simulation stages to incubate the robust platform. We engage with proven vendors for fabrication and assembly requirements to ensure timely delivery with quality.

Services provided under Platform Engineering are:

  • Substrate Design for Wirebond and Flip-Chip designs
  • High-speed boards designed up to 25G Serial and 4266MTs LPDDR4
  • Signal/Power Integrity for the complete platform
  • IP/SoC Validation/Characterization Platforms
  • Xilinx FPGA based custom platforms
  • Expertise in Cadence/Mentor toolchain for board design/layout
  • Expertise in Cadence Sigrity, Mentor HyperLynx & ADS SI tools.


SoCtronics Emulation services include FPGA based solutions, FPGA prototyping, and design porting to Emulators. With the increase in the complexity of the designs, time to market and robustness of the product are significant challenges that continue to exist. Early software development platform to improve silicon bring-up/product delivery time and platform with real-time interfaces to resolve asynchronous/system level scenarios are hard to simulate but made possible with the FPGA platforms

  • FPGA based solutions (Zynq 7000, Zynq MPSoC)
  • FPGA based emulation (Predominantly Xilinx FPGAs)
  • Mentor Veloce based emulation

Pre & Post Silicon Validation

With the increase in design complexity and Tape-out costs, affording a respin will impact the project or the profit margins. At SoCtronics, we consider Pre-Silicon validation as a critical sign-off criterion in the Chip design cycle to ensure first-pass silicon success. Our robust testplans and scalable methodology allow us to port the validation suite on processor independent platforms in no time. System-level usecases, Randomization, Compliance, Interoperability tests in the testplan ensure high coverage. Tests are developed in API’s based structure and can be used for board validation and characterization.

The following are some examples of services offered:

  • Test plan documentation derived from architecture specification
  • Test case development . FPGA/Silicon Bring-up
  • Feature level and Use case validation
  • Power/performance measurements
  • Debug/Failure Analysis
  • Diagnostics/Production Tests for platform screening


Complex SoC’s yield and robustness are directly related to the Silicon specification margin. With the variation and complexities involved due to the shrinking of technology node, a thorough understanding of the design margins is crucial. In characterization, Silicon is subjected to various environmental and test conditions to analyze the margins. With our well-equiped lab, automated test infrastructure, and experience, we can work with customers to articulate a testplan and execute meticulously. The test results are packaged into a silicon report highlighting the strength and weakness of the design along with recommendations on improvements for high yield/success rate.

The following are some examples of services offered:

  • Test plans & Automation development
  • AC/DC Analysis . IO/PLL Characterization
  • Receiver sensitivity tests
  • Debug/Failure Analysis
  • PVT analysis
  • Power and leakage measurements
  • Electrical compliance as per standards

The Right Choice

Contact us today to know more about our offerings and free consultation.

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